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PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
Rev. 1 -- 10 May 2011 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
1.2 Features and benefits
Forward current: IF 0.5 A Reverse voltage: VR 20 V Low forward voltage: VF 440 mV Ultra small and leadless SMD plastic package AEC-Q101 qualified Solderable side pads Package height typ. 0.37 mm
1.3 Applications
Low voltage rectification High efficiency DC-to-DC conversion Switch Mode Power Supply (SMPS) Reverse polarity protection Low power consumption applications Ultra high-speed switching
1.4 Quick reference data
Table 1. IF(AV) Quick reference data Conditions square wave; = 0.5; f = 20 kHz Tamb 85 C Tsp 130 C IR VR VF
[1] [2]
[1]
Symbol Parameter average forward current
Min [2]
Typ 300 365
Max 0.5 0.5 600 20 440
Unit A A A V mV
reverse current reverse voltage forward voltage
VR = 10 V IF = 500 mA
-
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Pulse test: tp 300 s; 0.02.
NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
Graphic symbol
1 2
sym001
1
2
Transparent top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3. Ordering information Package Name PMEG2005AELD Description leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm Version SOD882D Type number
4. Marking
Table 4. Marking codes Marking code[1] 1001 0000 Type number PMEG2005AELD
[1]
For SOD882D binary marking code description, see Figure 1.
4.1 Binary marking code description
CATHODE BAR READING DIRECTION VENDOR CODE
READING EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION
006aac477
Fig 1.
SOD882D binary marking code description
PMEG2005AELD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
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NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF(AV) Parameter reverse voltage average forward current square wave; = 0.5; f = 20 kHz Tamb 85 C Tsp 130 C IFRM IFSM Ptot repetitive peak forward current non-repetitive peak forward current total power dissipation tp 1 ms; 0.25 square wave; tp = 8 ms Tamb 25 C
[2] [1]
Conditions
Min -
Max 20
Unit V
-55 -65
0.5 0.5 2.5 3 340 660 1000 150 +150 +150
A A A A mW mW mW C C C
[3] [1] [4]
Tj Tamb Tstg
[1] [2] [3] [4]
junction temperature ambient temperature storage temperature
Tj = 25 C prior to surge.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on a ceramic PCB, Al2O3, standard footprint.
PMEG2005AELD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
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NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1][2] [1][3] [1][4]
Min -
Typ -
Max 370 190 125 50
Unit K/W K/W K/W K/W
Rth(j-sp)
[1] [2] [3] [4] [5]
thermal resistance from junction to solder point
[5]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint. Soldering point of cathode tab.
103
006aac557
duty cycle = Zth(j-a) (K/W) 1 0.75 0.5 0.33 102 0.25 0.1 0.2 0.05
0
0.02 0.01
10 10-3
10-2
10-1
1
10
102 tp (s)
103
FR4 PCB, standard footprint
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG2005AELD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
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NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
103
006aac558
Zth(j-a) (K/W) duty cycle = 1 102 0.5 0.25 0.1 0 0.05 0.02 0.01 0.75 0.33 0.2
10 10-3
10-2
10-1
1
10
102 tp (s)
103
FR4 PCB, mounting pad for cathode 1 cm2
Fig 3.
103
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac559
Zth(j-a) (K/W)
102
duty cycle = 1 0.75 0.5 0.33 0.1 0.05 0.02 0.01 0 0.25 0.2
10 10-3
10-2
10-1
1
10
102 tp (s)
103
Ceramic PCB, Al2O3, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG2005AELD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
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NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 100 mA IF = 500 mA IR Cd trr
[1] [2]
Conditions
[1]
Min [2]
Typ 20 65 125 210 365 300 500 19 6
Max 60 110 190 290 440 600 1500 25 -
Unit mV mV mV mV mV A A pF ns
reverse current diode capacitance reverse recovery time
Pulse test: tp 300 s; 0.02.
VR = 10 V VR = 20 V VR = 1 V; f = 1 MHz
-
When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
10 IF (A) 1
(1) (2)
006aac560
1 IR (A) 10-1 10-2 10-3
006aac561 (1)
(2) (3)
10-1
(3) (4) (5)
(4)
10-2
10-4 10-5
10-3 10-6 10-4 0 0.2 0.4 0.6 VF (V) 0.8 10-7 0 5
(5)
10
15 VR (V)
20
(1) Tj = 150 C (2) Tj = 125 C (3) Tj = 85 C (4) Tj = 25 C (5) Tj = -40 C
(1) Tj = 150 C (2) Tj = 125 C (3) Tj = 85 C (4) Tj = 25 C (5) Tj = -40 C
Fig 5.
Forward current as a function of forward voltage; typical values
Fig 6.
Reverse current as a function of reverse voltage; typical values
PMEG2005AELD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
6 of 14
NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
30 Cd (pF) 20
006aac562
10
0 0 5 10 15 VR (V) 20
f = 1 MHz; Tamb = 25 C
Fig 7.
0.4 PF(AV) (W) 0.3
Diode capacitance as a function of reverse voltage; typical values
006aac563
1.5 PR(AV) (W) 1.0
006aac564
(4) (3) (2) (1)
0.2
(1) (2) (3)
0.5 0.1
(4)
0.0 0.00
0.0 0.25 0.50 IF(AV) (A) 0.75 0 2 4 6 8 VR (V) 10
Tj = 150 C (1) = 0.1 (2) = 0.2 (3) = 0.5 (4) = 1
Tj = 125 C (1) = 1 (2) = 0.9 (3) = 0.8 (4) = 0.5
Fig 8.
Average forward power dissipation as a function of average forward current; typical values
Fig 9.
Average reverse power dissipation as a function of reverse voltage; typical values
PMEG2005AELD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
7 of 14
NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
0.75
(1)
006aac565
0.75
(1)
006aac566
IF(AV) (A)
(2)
IF(AV) (A)
(2)
0.50
0.50
(3) (4)
(3) (4)
0.25
0.25
0.00 0 25 50 75 100 125 150 175 Tamb (C)
0.00 0 25 50 75 100 125 150 175 Tamb (C)
FR4 PCB, standard footprint Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
FR4 PCB, mounting pad for cathode 1 cm2 Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
Fig 10. Average forward current as a function of ambient temperature; typical values
0.75
(1) 006aac567
Fig 11. Average forward current as a function of ambient temperature; typical values
0.75
(1) 006aac568
IF(AV) (A)
(2)
IF(AV) (A)
(2)
0.50
0.50
(3) (4)
(3) (4)
0.25
0.25
0.00 0 25 50 75 100 125 150 175 Tamb (C)
0.00 0 25 50 75 100 125 150 175 Tsp (C)
Ceramic PCB, Al2O3, standard footprint Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
Fig 12. Average forward current as a function of ambient temperature; typical values
PMEG2005AELD
Fig 13. Average forward current as a function of solder point temperature; typical values
(c) NXP B.V. 2011. All rights reserved.
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 1 -- 10 May 2011
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NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
8. Test information
tr D.U.T. RS = 50 V = VR + IF x RS IF SAMPLING OSCILLOSCOPE Ri = 50 VR
mga881
tp t
10 % + IF trr t
90 % input signal output signal
(1)
(1) IR = 1 mA
Fig 14. Reverse recovery time test circuit and waveforms
P t2 t1
duty cycle =
t1 t2
t
006aaa812
Fig 15. Duty cycle definition
The current ratings for the typical waveforms as shown in Figure 10, 11, 12 and 13 are calculated according to the equations: I F ( AV ) = I M x with IM defined as peak current, I RMS = I F ( AV ) at DC, and I RMS = I M x with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
PMEG2005AELD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
9 of 14
NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
9. Package outline
0.65 0.55 0.30 0.22 2
0.4 max
0.65 0.30 0.22 1
1.05 0.95
0.55 0.45 Dimensions in mm
cathode marking on top side 10-08-06
Fig 16. Package outline SOD882D
10. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMEG2005AELD
[1]
Package SOD882D
Description 2 mm pitch, 8 mm tape and reel
Packing quantity 10000 -315
For further information and the availability of packing methods, see Section 14.
11. Soldering
1.4 0.2
solder lands 0.8 (2x) 0.6 (2x) 0.7 (2x) solder resist solder paste Dimensions in mm 0.3 0.4 1 1.3
sod882d_fr
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering SOD882D
PMEG2005AELD All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
10 of 14
NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9. Revision history Release date 20110510 Data sheet status Product data sheet Change notice Supersedes Document ID PMEG2005AELD v.1
PMEG2005AELD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
11 of 14
NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
(c) NXP B.V. 2011. All rights reserved.
13.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
PMEG2005AELD
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Product data sheet
Rev. 1 -- 10 May 2011
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NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PMEG2005AELD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 10 May 2011
13 of 14
NXP Semiconductors
PMEG2005AELD
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 4.1 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Binary marking code description. . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 May 2011 Document identifier: PMEG2005AELD

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